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ISO 14001 Environmental Management Systems

ISO 14001 Environmental Management Systems
All company manufacturing operations employ an ISO 14001-conforming environmental management system to ensure compliance with regulations and Chip PC standards, to identify potential environmental impacts, and to set reduction targets.
The ISO 14001 system requires the integration of environmental planning and program management with day-to-day business activities. This process integrates environmental considerations with overall operational activities and encourages the application of innovative engineering solutions, creative partnerships, and employee involvement. 

ISO 14001 Environmental Design Guidelines

1.1. Scope

The following procedure should be implanted in Chip PC design processes to assure that the products and its manufacturing and handling processes are complying with environmental directives and are environmentally safe.

Note: Any deviation or suspected deviation should be reported within 24 hours to Chip PC’s or Elbit Environmental control officer.

1.2. Electronics Design

Chip PC's electronics design team and engineering shall comply with the following requirements:

  1. Selected SMT components should be lead-free whenever possible.
  2. Eliminate the use of components that contains cadmium, hexavalent, chromium, mercury, and lead from parts/materials supplied to Chip PC except where specific exemptions are allowed by the European Union ROHS Directive and project deviation is approved by Chip PC Environmental Officer.
  3. For electrolytic capacitors - prefer the use of Solid Tantalum capacitors throughout the design.
  4. For filter capacitors - prefer ceramic SMT capacitors over other types.
  5. All mechanical and thermal parts on designed boards should be made of pure Aluminum.
  6. Avoid using batteries and gold based capacitors.
  7. Use Sn finish instead of Sn/Pb for all new PCB production specifications.

1.3. Enclosure and Packaging Materials Design

Chip PC's enclosure and packaging design team and engineering shall comply with the following requirements:
  1. Do not use toxic heavy metals - including cadmium, mercury, hexavalent chromium, or lead in packaging.
  2. Do not use nylon wrapping materials.
  3. Use recyclable paper materials as much as possible.
  4. Reduce the weight and volume of packaging materials as much as possible.
  5. Try to design single package for multiple products.
  6. Reduce the use of color printed materials and packages.
  7. Use only CE approved bags with clear chocking hazardous warning.
  8. Mark all packaging materials with proper recycling marks.
  9. Mark plastic parts with recycling codes, as defined by ISO standards.
  10. For standard injected plastic materials use GE Cycoloy series only.
  11. PVC components and fasteners are not approved for new designs.
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