RISC processors are much more efficient than CISC (x86) processors. You can easily verify that if you take the heavy gaming machines, super-computers and servers ?€“ they are all powered by RISC. All other thin-client vendors cannot use RISC as they don't have the software expertise to support them.
Compared to x86 processors, RISC processors are:
a. Faster
b. Smaller in size
c. Cheaper
d. Much cooler
The Jack-PC chassis is made of special light-weight metal alloys. The mechanical structure is similar to laptops and video cameras.
Physical strength is important in case that the connected cables are violently pulled. In this case connectors and housing should sustain and survive the resulted stress. Another reason is to add mechanical strength to the anti-theft functions.
Jack-PC is always awake (listening to the LAN and reply with keep-alive to the management). When the device detects that user interaction stopped it is automatically enters low-power state. Therefore no power switch is needed.
How is the Jack-PC technology differs compared to other thin-clients?
The Jack-PC uses the latest IT and components technologies and is generations ahead of the competition. It is based on Chip PC's 22 patents in this field. Technologies used:
a. Layered 3d design to reduce space and improve signal integrity and speed
b. Fastest RISC architecture
c. Dual graphic core
d. Power Over Ethernet technologies
e. Strong device authentication technology
f. Secondary security processor technology
g. Fast DDR memory in Non-UMA
h. Highest efficiency high-frequency power supplies
i. Advanced thermal management
j. Light-weight alloy super-structure
k. Various miniaturization technologies
l. Advanced mass-storage technologies for highest reliability
Many other technologies and innovations...
No. The Jack-PC is not upgradeable. Still the chance that you will need any hardware upgrade throughout the product's life span is slim. Unlike PCs that requiring RAM to cope with ever increasing software requirements, thin-clients are using memory primarily to support OS and remote sessions.
The device comes with:
a. Enough RAM to support at least 10 simultaneous sessions. More than enough to run any future local OS enhancement
b. Enough disk space to load many Plug-Ins. Jack-PC features large Disk On Chips to allow multiple life-cycle image upgrades.
What is the maximum display resolution supported by the Jack-PC?
The maximum display resolution supported by the Jack-PC is 1280 x 1024 x 24 bit with the EFI-6800 and EFI-6900 products.
Note: Although other products may provide higher resolution, the 1280 x 1024 resolution is the maximum practical setting for ICA/RDP session in terms of bandwidth and server utilization. 1600 x 1280 setting is too high for ICA / RDP sessions.
How many concurrent sessions can be supported by the Jack-PC?
The number of concurrent ICA / RDP sessions is only limited by the device memory. Typically more than 10 simultaneous sessions can be used (depending on the session settings). In general it is a common practice to limit the number of sessions that user may open simultaneously to control servers loading.
What makes the Jack-PC the most reliable thin-client?
Most thin-client vendors claiming that their products are very reliable since they "don't have moving parts". While this is a nice claim, it certainly not accurate as moving parts are not necessarily the weakest link in the product. Chip PC uses the most advanced components, design features and testing technologies to extend the products life-span and improve reliability.
Jack-PC high reliability is contributed by the following features:
a. No hot parts - cold RISC architecture
b. The use of POE instead of traditional power supplies reduces the vulnerability to power supply induced failures
c. Using M-System highest reliability flash disks for storage. Most other vendors are using simple unreliable) NAND flash parts
d. Use of Solid tantalum capacitors compared to wet aluminum capacitors used by all other thin-client vendors
e. Half of number of components found in other thin-clients
f. No internal modules, wires, batteries and heat-sinks
g. High efficiency high-frequency power supplies
h. Light metal alloy super-structure
Login
| Partners | Contact 
